IP Library Granted Patent US 9,515,299
Granted Patent B2
US 9,515,299 · App. 14/007,652 · Granted Dec 6, 2016

Molding packaging material and battery case

Inventors: Tetsunobu Kuramoto (Isehara, JP); Yuuji Minamibori (Isehara, JP)
Assignee: SHOWA DENKO PACKAGING CO., LTD.
H01M2/0287B32B7/12B32B15/085B32B15/088B32B27/32B32B27/34B32B2250/03B32B2255/10B32B2255/26B32B2307/31B32B2307/518B32B2307/738B32B2439/70B32B2439/80B32B2457/10H01M10/0525
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Quick Facts
Patent No.
US 9,515,299
App. No.
14/007,652
Granted
Dec 6, 2016
Kind
B2
Abstract

Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and can have superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer ( 2 ) comprising a heat resistant resin; an inside sealant layer ( 3 ) comprising a thermoplastic resin; and a metal foil provided between the two layers as a barrier layer ( 4 ). A matte coat layer ( 6 ) comprising a heat resistant resin coating film containing a dispersion of inorganic or organic solid microparticles is formed on the outer surface of the outside substrate layer ( 2 ), and the gloss value of the surface thereof is suppressed to no greater than 30%.

Claims (29)

1. A molding packaging material, comprising:

an outside substrate layer containing a heat-resistant resin;

an inside sealant layer containing a thermoplastic resin; and

a metallic foil as a barrier layer provided between the layers;

wherein

a matte coat layer containing a heat-resistant resin composition containing a dispersion of inorganic and/or organic solid fine particles is formed by coating on an outside surface of the outside substrate layer, and

a gloss value of a surface on a side of the matte coat layer is 1% to 30%; wherein

the heat-resistant resin composition of the matte coat layer includes a dispersion of inorganic and/or organic solid fine particles having an average particle diameter of 1 μm to 10 μm.

2. A molding packaging material, comprising:

an outside substrate layer containing a heat-resistant resin;

an inside sealant layer containing a thermoplastic resin; and

a metallic foil as a barrier layer provided between the layers, wherein

at least an inside surface of the metallic foil layer is subjected to chemical conversion treatment, an inside adhesion resin layer having adhesiveness to both the metallic foil as the barrier layer and the resin of the inside sealant layer is laminated on the chemical conversion-treated surface, the inside sealant layer is further laminated through the adhesion resin layer,

the outside substrate layer contains a biaxially oriented polyamide resin film,

a matte coat layer containing a resin composition containing a dispersion of inorganic and/or organic solid fine particles in a heat-resistant resin component is formed by coating on an outside surface of the outside substrate layer, and

a gloss value of a surface on a side of the matte coat layer is 1% to 30%; wherein

the heat-resistant resin composition of the matte coat layer includes a dispersion of inorganic and/or organic solid fine particles having an average particle diameter of 1 μm to 10 μm.

3. The molding packaging material according to claim 1 , wherein the gloss value is 1% to 15%.

4. The molding packaging material according to claim 1 , wherein the heat-resistant resin includes fluorine added to a skeleton of a main agent as a main component.

5. The molding packaging material according to claim 4 , wherein the heat-resistant resin composition of the matte coat layer contains a two component curing type heat-resistant resin containing a copolymer of tetrafluoroolefin and carboxylic acid vinyl ester as a main component.

6. The molding packaging material according to claim 5 , wherein the heat-resistant resin composition of the matte coat layer further contains a urethane resin and/or an acrylic resin.

7. The molding packaging material according to claim 1 , wherein the heat-resistant resin composition of the matte coat layer includes a heat-resistant resin component including 0.1 to 60 wt % of the dispersion of the inorganic and/or organic solid fine particles.

8. The molding packaging material according to claim 1 , wherein the inside sealant layer contains a propylene homopolymer or a copolymer containing at least propylene and ethylene as a copolymerization component.

9. The molding packaging material according to claim 8 , wherein the inside sealant layer is the polymer or the copolymer having a melting point of 130° C. to 160° C. and an MFR of 1 to 25 g/10 min.

10. The molding packaging material according to claim 2 , wherein the inside adhesion resin layer contains an adhesive containing a polyolefin resin having a carboxyl group and a multifunctional isocyanate compound.

11. The molding packaging material according to claim 10 , wherein an equivalent ratio [NCO]/[OH] of an isocyanate group of the multifunctional isocyanate compound to a hydroxyl group constituting the carboxyl group of the polyolefin resin is 1.0 to 10.0.

12. The molding packaging material according to claim 10 , wherein, in the polyolefin resin having a carboxyl group, a melt flow rate (MFR) measured at 130° C. is 5 to 40 g/10 min.

13. A battery case, which is obtained by performing deep draw forming or bulging of the molding packaging material according to claim 1 .

14. The molding packaging material according to claim 1 , which is used as a packaging material for foods or pharmaceuticals.

Assignments (2)
CHANGE OF NAME Recorded Jul 25, 2023
From: SHOWA DENKO PACKAGING CO., LTD.
To: RESONAC PACKAGING CORPORATION
Reel/Frame 064374/0937 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2013
From: KURAMOTO, TETSUNOBU; MINAMIBORI, YUUJI
To: SHOWA DENKO PACKAGING CO.
Reel/Frame 031683/0272 →
Priority Claims (1)
JP 2011-072461 · Mar 29, 2011 · national
Continuity (1)
Related Publication 20140087241A1 · Mar 27, 2014