IP Library Assignment 033434/0031
Patent Assignment
Reel/Frame 033434/0031

Assignment of Assignor's Interest

Recorded: 2014-07-31 Pages: 3
Assignor
MINAMIBORI, YUJI
Executed: 2014-05-27
Assignee
SHOWA DENKO PACKAGING CO., LTD.
31, SUZUKAWA,, ISEHARA-SHI, KANAGAWA, 259-1146, JAPAN
Covered Property (1)
Molding Packaging Material
Patent: 9,502,695 →
Application: 14/269,270 →
Publication: US 2014/0335402
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jul 25, 2023
From: SHOWA DENKO PACKAGING CO., LTD.
To: RESONAC PACKAGING CORPORATION
Reel/Frame 064374/0937 →