IP Library Granted Patent US 9,502,695
Granted Patent B2
US 9,502,695 · App. 14/269,270 · Granted Nov 22, 2016

Molding packaging material

Inventor: Yuji Minamibori (Hikone, JP)
Assignee: Showa Denko Packaging Co., Ltd.
H01M2/0292H01M2/026H01M2/0262B32B15/092B32B15/095H01M2/0287H01M2002/0297Y10T428/24372Y10T428/24405Y10T428/24413Y10T428/24421
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Quick Facts
Patent No.
US 9,502,695
App. No.
14/269,270
Granted
Nov 22, 2016
Kind
B2
Abstract

A molding packaging material including a matte coat layer having excellent formability, chemical resistance, solvent resistance, and printability is provided. The molding packaging material 1 includes an outer base material 13 made of a heat-resistant resin, an inner sealant layer 16 made of a thermoplastic resin, a metal foil layer 11 arranged between the outer base material 13 and the inner sealant layer 16 , and a matte coat layer 14 formed on one side of the outer base material opposite to the other side thereof to which the metal foil layer 11 is arranged. The matte coat layer 14 is made from a resin composition containing a base compound resin including a phenoxy resin and a urethane resin, a curing agent, and solid fine particles.

Claims (34)

1. A molding packaging material comprising:

an outer base material made of a heat-resistant resin;

an inner sealant layer made of a thermoplastic resin;

a metal foil layer arranged between the outer base material and the inner sealant layer; and

a matte coat layer formed on one side of the outer base material opposite to the other side thereof on which the metal foil layer is arranged; wherein

the matte coat layer is made of a resin composition containing a base compound resin including a phenoxy resin and a urethane resin, a curing agent, and solid fine particles,

a mass ratio of the phenoxy resin and the urethane resin in the base compound resin is 0.6 to 1.6 urethane resin to 1 phenoxy resin,

an average particle size of the solid fine particles is 1 to 10 μm,

a content rate of the solid fine particles in the resin composition is 0.1 to 60% by weight,

the curing agent is an isocyanate component, and

a blending amount of the curing agent is 5 to 30 mass parts to 100 mass parts of the base compound resin.

2. The molding packaging material as recited in claim 1 , wherein the mass ratio of the phenoxy resin and the urethane resin is 0.8 to 1.4 urethane resin to 1 phenoxy resin.

3. The molding packaging material as recited in claim 1 , wherein the solid fine particles contains one or more types of inorganic fine particles selected from the group consisting of silica, alumina, calcium oxide, calcium carbonate, calcium sulfate, calcium silicate, and carbon black.

4. The molding packaging material as recited in claim 1 , wherein the solid fine particles contain one or more types of organic fine particles selected from the group consisting of an acrylic acid ester-based compound, a polystyrene-based compound, an epoxy-based resin, a polyamide-based compound, a cross-linked substance of an acrylic acid ester-based compound, a cross-linked substance of a polystyrene-based compound, a cross-linked substance of an epoxy-based resin, and a cross-linked substance of a polyamide-based compound.

5. The molding packaging material as recited in claim 1 , wherein the outer base material is constituted by a biaxially-stretched polyamide film.

6. The molding packaging material as recited in claim 1 , wherein the outer base material is constituted by a biaxially-stretched polyethylene terephthalate film.

7. The molding packaging material as recited in claim 1 , wherein the outer base material is constituted by a multi-layer film in which a polyethylene terephthalate film and a polyamide film are laminated.

8. The molding packaging material as recited in claim 1 , wherein the inner sealant layer is constituted by a thermoplastic resin non-stretched film.

9. The molding packaging material as recited in claim 1 , wherein the outer base material and the metal foil layer are joined by a two-liquid curing type urethane-based adhesive agent containing a polyol component and an isocyanate component.

10. The molding packaging material as recited in claim 1 , wherein a chemical conversion coating film is formed on at least one of surfaces of the metal foil.

11. The molding packaging material as recited in claim 1 , wherein the metal foil layer is constituted by an aluminum foil.

12. The molding packaging material as recited in claim 1 , wherein a viscosity of a solution including the base compound resin and the curing agent of the resin composition and having a solid content concentration of 25% by weight at 20° C. measured with a #4 Zahn cup is in a range of 10 to 30 seconds.

13. A molded case formed by deep-drawing or bulging a molding packaging material, wherein the molding packaging material comprises:

an outer base material made of a heat-resistant resin;

an inner sealant layer made of a thermoplastic resin;

a metal foil layer arranged between the outer base material and the inner sealant layer; and

a matte coat layer formed on one side of the outer base material opposite to the other side thereof to which the metal foil layer is arranged, wherein

the matte coat layer is made from a resin composition containing a base compound resin including a phenoxy resin and a urethane resin, a curing agent, and solid fine particles,

a mass ratio of the phenoxy resin and the urethane resin in the base compound resin is 0.6 to 1.6 urethane resin to 1 phenoxy resin,

an average particle size of the solid fine particles is 1 to 10 μm,

a content rate of the solid fine particles in the resin composition is 0.1 to 60% by weight,

the curing agent is an isocyanate component, and

a blending amount of the curing agent is 5 to 30 mass parts to 100 mass parts of the base compound resin.

14. A molded case as recited in claim 13 to be used as a battery case.

Assignments (2)
CHANGE OF NAME Recorded Jul 25, 2023
From: SHOWA DENKO PACKAGING CO., LTD.
To: RESONAC PACKAGING CORPORATION
Reel/Frame 064374/0937 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 31, 2014
From: MINAMIBORI, YUJI
To: SHOWA DENKO PACKAGING CO., LTD.
Reel/Frame 033434/0031 →
Priority Claims (2)
JP 2013-098136 · May 8, 2013 · national
JP 2014-047426 · Mar 11, 2014 · national
Continuity (1)
Related Publication 20140335402A1 · Nov 13, 2014