Patent Assignment
Reel/Frame 031683/0337
Assignment of Assignor's Interest
Recorded: 2013-11-27
Pages: 2
Assignee
SHOWA DENKO PACKAGING CO.
31, SUZUKAWA, ISEHARA-SHI, KANAGAWA, 259-1146, JAPAN
Covered Property
(1)
Molding Packaging Material and Battery Case
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.