IP Library Granted Patent US 9,925,740
Granted Patent B2
US 9,925,740 · App. 14/679,176 · Granted Mar 27, 2018

Method of manufacturing laminated armoring material

Inventor: Koji Minamitani (Minato-ku, JP)
Assignee: SHOWA DENKO PACKAGING CO., LTD.
B32B7/14B32B7/045B32B15/08B32B27/32B32B27/34B32B27/36B32B27/40B32B37/0053B32B37/0076B32B37/02B32B37/1292B32B38/10B32B2250/03B32B2255/06B32B2255/26B32B2307/306B32B2307/31B32B2310/0843B32B2311/12B32B2311/16B32B2311/22B32B2311/24B32B2323/04B32B2323/10B32B2367/00B32B2377/00B32B2571/02Y10T156/1082Y10T428/24851
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Quick Facts
Patent No.
US 9,925,740
App. No.
14/679,176
Granted
Mar 27, 2018
Kind
B2
Abstract

In laminating resin layers on both surfaces of a metal foil layer by adhering a heat-resistant resin layer to a first surface of the metal foil layer and adhering a heat-sealable resin layer to a second surface thereof, as an adhering method, by employing an adhesive agent unapplied portion forming and adhering process in which the resin layer and the metal foil layer are adhered together by applying an adhesive agent to a region of a joining face of both the layers excluding a part of the region so that an adhesive agent unapplied section is formed, a laminated body having the adhesive agent unapplied section is manufactured. A resin layer removal process for removing a resin layer corresponding to the adhesive agent unapplied section of the laminated body to expose the metal foil layer is performed.

Claims (14)

1. A method of manufacturing a laminated armoring material, comprising:

adhering a first resin layer to a first surface of a metal foil layer via a first adhesive agent layer;

adhering a second resin layer to a second surface of the metal foil layer via a second adhesive agent layer; and

removing a part of at least one of the first resin layer and the second resin layer,

wherein the at least one of the first resin layer and the second resin layer is adhered to the metal foil layer via one of the first adhesive agent layer and the second adhesive agent layer formed by applying an adhesive agent to a joining region of the metal foil layer and the at least one of the first resin layer and the second resin layer excluding a part of the joining region so that an adhesive agent unapplied section in which the adhesive agent is not applied is formed, and

wherein the part of at least one of the first resin layer and the second resin layer corresponds to the adhesive agent unapplied section, and is removed to expose the metal foil layer.

2. The method of manufacturing the laminated armoring material as recited in claim 1 , wherein the adhesive agent is applied using a roll having concave and convex portions on a peripheral surface to form the adhesive agent unapplied section corresponding to a shape of the convex portion.

3. The method of manufacturing the laminated armoring material as recited in claim 1 , wherein removing the part of at least one of the first resin layer and the second resin layer is executed to a flat-sheet like laminated body for an armoring material before being processed into a case.

4. The method of manufacturing the laminated armoring material as recited in claim 3 , wherein the process into the case is a plastic deformation process for forming a concave portion from a flat sheet.

5. The method of manufacturing the laminated armoring material as recited in claim 3 , wherein the process into the case is a bag-making process for forming a flat sheet into a bag shape.

6. The method of manufacturing the laminated armoring material as recited in claim 1 , wherein removing the part of at least one of the first resin layer and the second resin layer is executed after a flat-sheet like laminated body for a laminated armoring material is processed into a case.

7. The method of manufacturing the laminated armoring material as recited in claim 1 , wherein the part of at least one of the first resin layer and the second resin layer is cut by irradiating a laser.

8. The method of manufacturing the laminated armoring material as recited in claim 1 , wherein a conductive plating film is formed at least on a metal exposed section of the metal foil layer.

9. The method of manufacturing the laminated armoring material as recited in claim 1 , wherein the first resin layer is a heat-resistant layer and the second resin layer is a heat-sealable layer.

Assignments (2)
CHANGE OF NAME Recorded Jul 25, 2023
From: SHOWA DENKO PACKAGING CO., LTD.
To: RESONAC PACKAGING CORPORATION
Reel/Frame 064374/0937 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2015
From: MINAMITANI, KOJI
To: SHOWA DENKO PACKAGING CO., LTD.
Reel/Frame 035486/0059 →
Priority Claims (1)
JP 2014-078786 · Apr 7, 2014 · national
Continuity (1)
Related Publication 20150283790A1 · Oct 8, 2015