IP Library Granted Patent US 9,553,283
Granted Patent B1
US 9,553,283 · App. 15/275,618 · Granted Jan 24, 2017

Molding packaging material and battery case

Inventors: Tetsunobu Kuramoto (Isehara, JP); Yuuji Minamibori (Isehara, JP)
Assignee: SHOWA DENKO PACKAGING CO., LTD.
H01M2/0287H01M10/0525
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Quick Facts
Patent No.
US 9,553,283
App. No.
15/275,618
Granted
Jan 24, 2017
Kind
B1
Abstract

Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and can have superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer ( 2 ) comprising a heat resistant resin; an inside sealant layer ( 3 ) comprising a thermoplastic resin; and a metal foil provided between the two layers as a barrier layer ( 4 ). A matte coat layer ( 6 ) comprising a heat resistant resin coating film containing a dispersion of inorganic or organic solid microparticles is formed on the outer surface of the outside substrate layer ( 2 ), and the gloss value of the surface thereof is suppressed to no greater than 30%.

Claims (10)

1. A method for manufacturing a molding packaging material, comprising:

a step of subjecting at least one surface of a metallic foil for a barrier layer to chemical conversion treatment;

a step of bonding a biaxially oriented polyamide film to the other surface of the metallic foil with an outside adhesive to form an outside substrate layer;

a step of applying a resin composition in which 0.1 wt % to 60 wt % of a dispersion of inorganic and/or organic solid fine particles having an average particle diameter of 1 μm to 10 μm is contained in a two component curing type heat-resistant resin to a surface of the outside substrate layer, and then drying to form a matte coat layer whose gloss value is controlled to be 1 to 30%;

a step of forming an inside adhesion resin layer having adhesiveness to both the metallic foil as the barrier layer and a resin of an inside sealant layer described later on one chemical conversion-treated surface of the metallic foil;

a step of laminating and forming the sealant layer containing a thermoplastic resin on the inside adhesion resin layer; and

a step of heat treating a laminate obtained by the steps above with a heat roll heated to 130° C. to 220° C. in such a manner that the outside substrate layer is on the side of the heat roll.

2. The method for manufacturing a molding packaging material according to claim 1 , wherein a resin containing a propylene homopolymer or a copolymer resin containing at least propylene and ethylene as a copolymerization component and having a melting point of 130° C. to 160° C. and an MFR of 1 to 25 g/10 min is used as the thermoplastic resin of the sealant layer.

3. The method for manufacturing a molding packaging material according to claim 1 , wherein the inside adhesion resin layer is formed by applying and drying an adhesion resin containing a polyolefin resin having a carboxyl group and a multifunctional isocyanate compound and having an equivalent ratio [NCO]/[OH] of an isocyanate group of the multifunctional isocyanate compound to a hydroxyl group constituting the carboxyl group of the polyolefin resin of 1.0 to 10.0.

4. The method for manufacturing a molding packaging material according to claim 1 , wherein the two component curing type heat-resistant resin includes a copolymer of tetrafluoroolefin and carboxylic acid vinyl ester.

Assignments (2)
CHANGE OF NAME Recorded Jul 25, 2023
From: SHOWA DENKO PACKAGING CO., LTD.
To: RESONAC PACKAGING CORPORATION
Reel/Frame 064374/0937 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2016
From: KURAMOTO, TETSUNOBU; MINAMIBORI, YUUJI
To: SHOWA DENKO PACKAGING CO., LTD.
Reel/Frame 039854/0952 →
Priority Claims (1)
JP 2011-072461 · Mar 29, 2011 · national
Continuity (1)
Division 14007652