IP Library Granted Patent US 9,070,919
Granted Patent B2
US 9,070,919 · App. 13/141,141 · Granted Jun 30, 2015

Positive electrode tab lead, negative electrode tab lead, and battery

Inventors: Kiyoshi Tada (Oyama, JP); Daisuke Hashimoto (Oyama, JP); Satoshi Yamazaki (Sagamihara, JP)
Assignee: Showa Denko Packaging Co., Ltd.
H01M2/06H01M2/266H01M2/30H01M2/305H01M2/32H01M10/052
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Quick Facts
Patent No.
US 9,070,919
App. No.
13/141,141
Granted
Jun 30, 2015
Kind
B2
Abstract

The present invention is to provide a positive tab lead capable of being connected with each other with a sufficient connection strength at a low energy cost. It is constituted such that a partial coating layer ( 13 ) made of nickel, tin or solder is formed on at least a part of a region of an aluminum plate ( 11 ) exposed to an outside of an outer cover. It is preferable to form a chitosan layer ( 14 ) containing one or more compounds selected from the group consisting of chitosan and chitosan derivatives on the surface of the tab lead.

Claims (10)

1. A positive tab lead comprising:

an aluminum plate;

a partial coating layer made of nickel, tin or solder formed on at least both sides of a region of the aluminum plate to be exposed to an outside of an outer cover; and

an insulating tab film thermally welded to both sides of a longitudinally intermediate region of the aluminum plate such that the insulating tab film extends over both of at least a portion of the region where the partial coating layer is formed and at least a portion of the region where the partial coating layer is not formed; wherein

the insulating tab film is not provided over an outer end region of the aluminum plate; and

an edge portion of the outer cover is arranged such that the edge portion pinches the insulating tab film, and the edge portion of the outer cover is sealed to the insulating tab film.

2. The positive tab lead as recited in claim 1 , wherein a surface roughness Ra of the aluminum plate is 0.03 to 0.5 μm.

3. The positive tab lead as recited in claim 1 , wherein a surface roughness Ra of a region of the aluminum plate where the partial coating layer is not formed is 0.03 to 0.5 μm.

4. The positive tab lead as recited in claim 1 , wherein the partial coating layer is formed on an entire region of the aluminum plate to be exposed to the outside of the outer cover.

5. The positive tab lead as recited in claim 1 , wherein a chitosan layer containing one or more compounds selected from a group consisting of chitosan and chitosan derivatives is further formed on a surface of the partial coating layer and the aluminum plate.

Assignments (3)
CHANGE OF NAME Recorded Jul 25, 2023
From: SHOWA DENKO PACKAGING CO., LTD.
To: RESONAC PACKAGING CORPORATION
Reel/Frame 064374/0937 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2014
From: SHOWA DENKO K.K.
To: SHOWA DENKO PACKAGING CO.
Reel/Frame 032354/0366 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2011
From: TADA, KIYOSHI; HASHIMOTO, DAISUKE; YAMAZAKI, SATOSHI
To: SHOWA DENKO K.K.
Reel/Frame 026841/0591 →
Priority Claims (2)
JP 2008-325521 · Dec 22, 2008 · national
JP 2009-126176 · May 26, 2009 · national
Continuity (1)
Related Publication 20110305945A1 · Dec 15, 2011