Molding material for package
A molding material for package includes a matte-coating layer having excellent formability, chemical resistance, solvent resistance, electrolytic solution resistance and printing property. The molding material for package includes an outer base material layer including a heat-resistant resin; an inner sealant layer including a thermoplastic resin; a metal foil layer disposed between the outer base material layer and the inner sealant layer; and a matte-coating layer formed on a side opposite to the metal foil layer of the outer base material layer, wherein the matte-coating layer is a multilayer including a bottom layer including a resin composition including a main agent resin including a phenoxy resin and a urethane resin, a curing agent, and solid fine particles; and an upper layer including a resin composition including a fluorine-containing resin.
1. A molding material for package comprising:
an outer base material layer comprising a heat-resistant resin;
an inner sealant layer comprising a thermoplastic resin;
a metal foil layer disposed between the outer base material layer and the inner sealant layer; and
a matte-coating layer formed on a side of the outer base material layer that is opposite to another side of the outer base material layer on which the metal foil layer is disposed, wherein
the matte-coating layer includes:
a bottom layer including:
a resin composition including:
a main resin including a phenoxy resin and a urethane resin;
a curing agent; and
solid fine particles; and
an upper layer comprising a resin composition including a fluorine-containing resin.
2. The molding material for package according to claim 1 , wherein the fluorine-containing resin in the resin composition forming the upper layer of the matte-coating layer includes a heat-resistant resin in which fluorine is added to a backbone of a main agent.
3. The molding material for package according to claim 1 , wherein the fluorine-containing resin in the resin composition forming the upper layer of the matte-coating layer includes a two-component curing type fluororesin comprising a copolymer of a tetrafluoroolefin and a vinyl carboxylate.
4. The molding material for package according to claim 1 , wherein the bottom layer of the matte-coating layer has a thickness of 2 to 5 μm.
5. The molding material for package according to claim 1 , wherein the upper layer of the matte-coating layer has a thickness of 0.2 to 2 μm.
6. The molding material for package according to claim 1 , wherein the main resin in the resin composition forming the bottom layer of the matte-coating layer includes the phenoxy resin and the urethane resin in a mass ratio of 0.6 to 1.6 of the urethane resin relative to 1 of the phenoxy resin.
7. The molding material for package according to claim 1 , wherein the solid fine particles in the resin composition forming the bottom layer of the matte-coating layer have an average particle size of 1 to 5 μm.
8. The molding material for package according to claim 1 , wherein the resin composition forming the bottom layer of the matte-coating layer includes the solid fine particles in a content of 1 to 50% by mass.
9. A molded case obtained by subjecting the molding material for package according to claim 1 to deep-drawing or stretch-forming.
10. The molded case according to claim 9 , which is used as a case for a battery.