Patent Assignment
Reel/Frame 034057/0738
Assignment of Assignor's Interest
Recorded: 2014-10-29
Pages: 3
Assignee
SHOWA DENKO PACKAGING CO., LTD.
31, SUZUKAWA,, ISEHARA-SHI, KANAGAWA, 259-1146, JAPAN
Covered Property
(1)
Molding Material for Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.