IP Library Granted Patent US 9,649,827
Granted Patent B2
US 9,649,827 · App. 14/868,498 · Granted May 16, 2017

Molding packaging material and molded case

Inventors: Honglin Wang (Isehara, JP); Yuji Minamibori (Isehara, JP)
Assignee: Showa Denko Packaging Co., Ltd.
B32B15/08B32B7/12B32B15/06B32B15/18B32B15/20B32B25/08B32B27/08B32B27/304B32B27/308B32B27/32B32B27/322B32B27/36B32B27/38B32B27/40H01M2/0287H01M2/0292H01M10/0525B32B15/088B32B15/095B32B27/34B32B2250/03B32B2255/10B32B2255/26B32B2264/10B32B2307/306B32B2307/31B32B2307/514B32B2307/584B32B2307/714B32B2307/7244B32B2307/7246B32B2439/00B32B2439/70B32B2439/80B32B2457/10
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Quick Facts
Patent No.
US 9,649,827
App. No.
14/868,498
Granted
May 16, 2017
Kind
B2
Abstract

A molding packaging material includes an outer substrate layer made of a heat-resistant resin, an inner sealant layer made of a thermoplastic resin, a metallic foil layer provided between the outer substrate layer and the inner sealant layer, and a protection coat layer formed on a side opposite to the metallic foil layer side of the outer substrate layer. The protection coat layer is made of a resin composition including a main resin containing a phenoxy resin and a urethane resin, and a curing agent, and has a thickness of 0.1 μm to 10 μm.

Claims (23)

1. A molding packaging material comprising:

an outer substrate layer made of a heat-resistant resin;

an inner sealant layer made of a thermoplastic resin;

a metallic foil layer arranged between the outer substrate layer and the inner sealant layer; and

a protection coat layer formed on a side opposite to the metallic foil layer side of the outer substrate layer, wherein

the protection coat layer is made of a resin composition including a main resin containing a phenoxy resin and a urethane resin, and a curing agent, and has a thickness of 0.1 μm to 10 μm;

the curing agent is an isocyanate component; and

an amount of the curing agent in the resin composition is 5 to 30 mass parts to 100 mass parts of the main resin.

2. The molding packaging material as recited in claim 1 , wherein a mass ratio of the phenoxy resin and the urethane resin in the main resin is 0.6 to 1.6 urethane resin to 1 phenoxy resin.

3. The molding packaging material as recited in the claim 1 , wherein the outer substrate layer is made of a polyamide resin.

4. The molding packaging material as recited in claim 1 , wherein a thickness of the metallic foil layer is 10 μm to 40 μm.

5. A molded case made by subjecting the molding packaging material as recited in claim 1 to deep-drawing or bulging.

6. The molded case as recited in claim 5 , wherein the molded case is used as a battery case.

7. The molding packaging material as recited in claim 1 , wherein a viscosity of a solution including the main resin and the curing agent of the resin composition and having a solid content concentration of 25 mass % at 20° C. measured with a #4 Zahn cup is in a range of 10 to 30 seconds.

8. A molding packaging material comprising:

an outer substrate layer made of a heat-resistant resin;

an inner sealant layer made of a thermoplastic resin;

a metallic foil layer arranged between the outer substrate layer and the inner sealant layer; and

a protection coat layer formed on a side opposite to the metallic foil layer side of the outer substrate layer; wherein

the protection coat layer is made of a resin composition including a main resin and a curing agent, and has a thickness of 0.1 μm to 10 μm;

the main resin contains a phenoxy resin, a urethane resin, and a resin including fluorine and an acrylate resin;

the curing agent is an isocyanate component; and

an amount of the curing agent in the resin composition is 5 to 30 mass parts to 100 mass parts of the main resin.

Assignments (2)
CHANGE OF NAME Recorded Jul 25, 2023
From: SHOWA DENKO PACKAGING CO., LTD.
To: RESONAC PACKAGING CORPORATION
Reel/Frame 064374/0937 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 16, 2015
From: WANG, HONGLIN; MINAMIBORI, YUJI
To: SHOWA DENKO PACKAGING CO., LTD.
Reel/Frame 036807/0394 →
Priority Claims (1)
JP 2014-200099 · Sep 30, 2014 · national
Continuity (1)
Related Publication 20160089861A1 · Mar 31, 2016