Patent Assignment
Reel/Frame 036807/0394
Assignment of Assignor's Interest
Recorded: 2015-10-16
Pages: 3
Assignee
SHOWA DENKO PACKAGING CO., LTD.
31, SUZUKAWA,, ISEHARA-SHI, KANAGAWA, 259-1146, JAPAN
Covered Property
(1)
Molding Packaging Material and Molded Case
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.