Patent Assignment
Reel/Frame 032837/0032
Assignment of Assignor's Interest
Recorded: 2014-05-07
Pages: 3
Assignee
SHOWA DENKO PACKAGING CO.
31, SUZUKAWA,, ISEHARA-SHI, KANAGAWA, 259-1146, JAPAN
Covered Property
(1)
Molding Packaging Material and Molded Case
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.