IP Library Assignment 034864/0010
Patent Assignment
Reel/Frame 034864/0010

Assignment of Assignor's Interest

Recorded: 2015-02-02 Pages: 5
Assignors
ITO, TAKAHIRO
Executed: 2014-12-26
KOMANO, JUNYA
Executed: 2015-01-26
IMAHORI, MAKOTO
Executed: 2014-12-26
KURAMOTO, TETSUNOBU
Executed: 2014-12-08
MINAMIBORI, YUUJI
Executed: 2014-12-01
Assignees
SHOWA DENKO PACKAGING CO., LTD.
31, SUZUKAWA,, ISEHARA-SHI, KANAGAWA, 259-1146, JAPAN
TOAGOSEI CO., LTD.,
1-14-1, NISHI SHIMBASHI, MINATO-KU, TOKYO, 105-8419, JAPAN
Covered Property (1)
Molding Packaging Material and Method for Producing Same
Application: 14/375,138 →
Publication: US 2015/0004476
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jul 25, 2023
From: SHOWA DENKO PACKAGING CO., LTD.
To: RESONAC PACKAGING CORPORATION
Reel/Frame 064374/0937 →