Patent Assignment
Reel/Frame 030584/0411
Assignment of Assignor's Interest
Recorded: 2013-06-11
Pages: 5
Assignors
KUO, KAI-SHIANG
Executed: 2013-03-24
CHANG, KEN-YU
Executed: 2013-03-25
LEE, YA-LIEN
Executed: 2013-03-25
SU, HUNG-WEN
Executed: 2013-03-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Forming Hybrid Diffusion Barrier Layer and Semiconductor Device Thereof