Patent Assignment
Reel/Frame 030597/0987
Assignment of Assignor's Interest
Recorded: 2013-06-12
Pages: 4
Assignors
HUANG, KUEI-WEI
Executed: 2013-05-28
CHEN, WEI-YU
Executed: 2013-05-28
CHEN, MENG-TSE
Executed: 2013-05-28
LIN, WEI-HUNG
Executed: 2013-05-28
CHENG, MING-DA
Executed: 2013-05-28
LIU, CHUNG-SHI
Executed: 2013-05-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package on Package Bonding Structure and Method for Forming the Same