Patent Assignment
Reel/Frame 030606/0348
Assignment of Assignor's Interest
Recorded: 2013-06-13
Pages: 6
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Method of Processing Substrate, Substrate Processing Apparatus, and Recording Medium
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.