Assignment of Assignor's Interest

Recorded: 2013-06-14 Pages: 7

Assignor

INTERMOLECULAR, INC.

Executed: 2013-06-11

Assignees

SANDISK 3D LLC

951 SANDISK BOULEVARD, MILPITAS, CALIFORNIA, 95035

KABUSHIKI KAISHA TOSHIBA

1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105, JAPAN

Covered Property (1)

Interface Layer Improvements for Nonvolatile Memory Applications

Application: 13/228,744 →

Publication: US 2013/0065377

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.