Patent Assignment
Reel/Frame 030631/0237
Assignment of Assignor's Interest
Recorded: 2013-06-18
Pages: 8
Assignors
CHOI, SANG-HYUN
Executed: 2013-03-14
NOH, JIN-HO
Executed: 2013-03-15
SON, YOON-HO
Executed: 2013-03-15
CHUNG, DAE-HYUK
Executed: 2013-03-15
HWANG, IN-SEAK
Executed: 2013-03-15
PARK, TAE-JOON
Executed: 2013-03-15
HWANG, TAE-HO
Executed: 2013-03-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Semiconductor Device