Patent Assignment
Reel/Frame 030638/0814
Assignment of Assignor's Interest
Recorded: 2013-06-18
Pages: 14
Assignors
WEI, MING-TE
Executed: 2013-06-10
TSAO, PO-CHAO
Executed: 2013-06-10
YANG, CHING-LI
Executed: 2013-06-10
CHEN, CHIEN-YANG
Executed: 2013-06-10
CHEN, HUI-LING
Executed: 2013-06-10
HUANG, GUAN-KAI
Executed: 2013-06-10
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Die Seal Ring and Method of Forming the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.