Patent Assignment
Reel/Frame 030639/0058
Assignment of Assignor's Interest
Recorded: 2013-06-19
Pages: 4
Assignors
CHUANG, HAO-HSIANG
Executed: 2013-05-22
LIANG, SHIH-WEI
Executed: 2013-05-22
YANG, CHING-FENG
Executed: 2013-05-22
WU, KAI-CHIANG
Executed: 2013-05-22
TSAI, HAO-YI
Executed: 2013-05-22
WANG, CHUEI-TANG
Executed: 2013-05-22
YU, CHEN-HUA
Executed: 2013-05-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Polymer Layers Embedded with Metal Pads for Heat Dissipation