Patent Assignment
Reel/Frame 030639/0093
Assignment of Assignor's Interest
Recorded: 2013-06-19
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Fan-Out Package Structure and Methods for Forming the Same