IP Library › Assignment 030639/0153
Patent Assignment
Reel/Frame 030639/0153

Assignment of Assignor's Interest

Recorded: 2013-06-19 Pages: 5
Assignors
CHOU, BRUCE C.S.
Executed: 2013-04-06
WANG, CHEN-JONG
Executed: 2013-05-06
LIU, PING-YIN
Executed: 2013-05-06
TU, JUNG-KUO
Executed: 2013-05-06
CHOU, TSUNG-TE
Executed: 2013-05-06
HUANG, XIN-HUA
Executed: 2013-05-06
KUANG, XIN-CHUNG
Executed: 2013-05-06
CHAO, LAN-LIN
Executed: 2013-05-06
TSAI, CHIA-SHIUNG
Executed: 2013-04-06
CHEN, XIAOMENG
Executed: 2013-04-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Air Trench in Packages Incorporating Hybrid Bonding
Patent: 9,443,796 →
Application: 13/895,122 →
Publication: US 2014/0264948
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Correct the 7TH Inventor's Name Previously Recorded on Reel 030639 Frame 0153. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest. Mar 7, 2017
From: CHOU, BRUCE C.S.; WANG, CHEN-JONG; LIU, PING-YIN; TU, JUNG-KUO
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 041901/0060 →