IP Library › Assignment 041901/0060
Patent Assignment
Reel/Frame 041901/0060

Corrective Assignment to Correct the Correct the 7TH Inventor's Name Previously Recorded on Reel 030639 Frame 0153. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.

Recorded: 2017-03-07 Pages: 9
Assignors
CHOU, BRUCE C.S.
Executed: 2017-01-19
WANG, CHEN-JONG
Executed: 2017-01-10
LIU, PING-YIN
Executed: 2017-02-08
TU, JUNG-KUO
Executed: 2017-01-19
CHOU, TSUNG-TE
Executed: 2017-01-19
HUANG, XIN-HUA
Executed: 2017-01-08
KUANG, HSUN-CHUNG
Executed: 2017-02-09
CHAO, LAN-LIN
Executed: 2017-02-08
TSAI, CHIA-SHIUNG
Executed: 2017-02-08
CHEN, XIAOMENG
Executed: 2017-02-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Properties (2)
Air Trench in Packages Incorporating Hybrid Bonding
Patent: 9,443,796 →
Application: 13/895,122 →
Publication: US 2014/0264948
Air Trench in Packages Incorporating Hybrid Bonding
Patent: 9,502,396 →
Application: 15/042,268 →
Publication: US 2016/0163684
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 19, 2013
From: CHOU, BRUCE C.S.; WANG, CHEN-JONG; LIU, PING-YIN; TU, JUNG-KUO
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 030639/0153 →