Patent Assignment
Reel/Frame 030640/0889
Assignment of Assignor's Interest
Recorded: 2013-06-19
Pages: 3
Assignors
YU, TSUNG-YUAN
Executed: 2013-04-29
CHEN, HSIEN-WEI
Executed: 2013-04-29
LU, WEN-HSIUNG
Executed: 2013-04-29
LIN, HUNG-JEN
Executed: 2013-03-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Methods and Apparatus for Wafer Level Packaging