Patent Assignment
Reel/Frame 030642/0319
Assignment of Assignor's Interest
Recorded: 2013-06-19
Pages: 8
Assignors
KIM, SANG-WON
Executed: 2013-06-11
KIM, JONG-YOUN
Executed: 2013-06-11
CHOI, EUN-KYOUNG
Executed: 2013-06-11
HAN, SANG-UK
Executed: 2013-06-11
HONG, JI-SEOK
Executed: 2013-06-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Wafer Level Package