Patent Assignment
Reel/Frame 030647/0688
Assignment of Assignor's Interest
Recorded: 2013-06-14
Pages: 2
Assignors
SASAJIMA, RYOTA
Executed: 2013-05-29
NAKAMURA, YOSHINOBU
Executed: 2013-05-29
TAKASAWA, YUSHIN
Executed: 2013-05-31
HIROSE, YOSHIRO
Executed: 2013-05-29
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO 1018980, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Substrate Processing Method, Computer-Readable Medium with Program for Executing a Substrate Processing Method, and Substrate Processing Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.