Patent Assignment
Reel/Frame 030673/0384
Assignment of Assignor's Interest
Recorded: 2013-06-24
Pages: 6
Assignor
AKADA, HIKARU
Executed: 2013-05-28
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method for Obtaining Data of Substrate Processing Apparatus and Sensor Substrate