Patent Assignment
Reel/Frame 030683/0543
Assignment of Assignor's Interest
Recorded: 2013-06-25
Pages: 6
Assignors
PARK, JAE-HWA
Executed: 2013-06-18
MOON, KWANG-JIN
Executed: 2013-06-18
PARK, BYUNG-LYUL
Executed: 2013-06-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Including a via Structure and Methods of Fabricating Integrated Circuit Devices Including a via Structure