Patent Assignment
Reel/Frame 030712/0203
Assignment of Assignor's Interest
Recorded: 2013-06-28
Pages: 9
Assignors
DO, BYUNG TAI
Executed: 2013-06-28
TRASPORTO, ARNEL SENOSA
Executed: 2013-06-28
CHUA, LINDA PEI EE
Executed: 2013-06-28
BATHAN, HENRY DESCALZO
Executed: 2013-06-28
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Trace Protection Layer and Method of Manufacture Thereof
Patent:
9,177,897 →
Application:
13/930,319 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.