IP Library › Assignment 030718/0356
Patent Assignment
Reel/Frame 030718/0356

Assignment of Assignor's Interest

Recorded: 2013-07-01 Pages: 10
Assignors
HUANG, BO-JR
Executed: 2013-03-05
SHEN, WILLIAM WU
Executed: 2013-03-05
CHIEN, CHIN-HER
Executed: 2013-06-21
LIU, CHIN-CHOU
Executed: 2013-03-05
LEE, YUN-HAN
Executed: 2013-03-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Integrated Antenna on Interposer Substrate
Patent: 9,779,990 →
Application: 13/778,528 →
Publication: US 2014/0239427