Patent Assignment
Reel/Frame 030721/0688
Assignment of Assignor's Interest
Recorded: 2013-07-01
Pages: 3
Assignor
SHUTO, TAKASHI
Executed: 2013-06-21
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Package Assembly for Embedded Die and Associated Techniques and Configurations
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.