Patent Assignment
Reel/Frame 030729/0151
Assignment of Assignor's Interest
Recorded: 2013-07-02
Pages: 9
Assignors
RAORANE, DIGVIJAY A.
Executed: 2013-05-09
LI, YONGGANG
Executed: 2013-05-10
MANEPALLI, RAHUL N.
Executed: 2013-05-31
GONZALEZ, JAVIER SOTO
Executed: 2013-05-10
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Multichip Integration with Through Silicon via (Tsv) Die Embedded in Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.