Assignment of Assignor's Interest

Recorded: 2013-06-28 Pages: 2

Assignors

YUASA, KAZUHIRO

Executed: 2013-06-12

YAMAMOTO, RYUJI

Executed: 2013-06-17

Assignee

HITACHI KOKUSAI ELECTRIC INC.

14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO 1018980, JAPAN

Covered Property (1)

Method of Manufacturing Semiconductor Device, Substrate Processing Method and Substrate Processing Apparatus

Patent: 8,822,350 →

Application: 13/988,441 →

Publication: US 2013/0280919

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.