Patent Assignment
Reel/Frame 030748/0967
Assignment of Assignor's Interest
Recorded: 2013-07-08
Pages: 4
Assignor
NEC CORPORATION
Executed: 2013-06-21
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing Same, Wiring Board and Method of Manufacturing Same, Semiconductor Package, and Electronic Device
Application:
13/864,119 →
Publication:
US 2013/0234295