Patent Assignment
Reel/Frame 030751/0300
Assignment of Assignor's Interest
Recorded: 2013-07-08
Pages: 4
Assignors
CHANG, TANG-KUEI
Executed: 2013-04-26
WEI, KUO-HSIU
Executed: 2013-04-26
CHEN, KEI-WEI
Executed: 2013-04-26
LO, WEI-JEN
Executed: 2013-05-22
WANG, YING-LANG
Executed: 2013-04-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Wafer Polishing Tool Using Abrasive Tape