Patent Assignment
Reel/Frame 030757/0615
Assignment of Assignor's Interest
Recorded: 2013-07-09
Pages: 4
Assignors
KUO, NICK
Executed: 2003-09-10
CHOU, CHIU-MING
Executed: 2003-09-10
CHOU, CHIEN-KANG
Executed: 2003-09-10
LIN, CHU-FU
Executed: 2003-09-10
Assignee
MEGIC CORPORATION
NO. 21, R&D 1ST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Property
(1)
Chip Structure with Bumps and Testing Pads
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 10, 2013
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030770/0132 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →