IP Library › Assignment 030770/0132
Patent Assignment
Reel/Frame 030770/0132

Assignment of Assignor's Interest

Recorded: 2013-07-10 Pages: 5
Assignor
MEGIC CORPORATION
Executed: 2006-04-28
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Properties (8)
Method for Fabricating Circuitry Component
Patent: 7,297,614 →
Application: 10/794,472 →
Publication: US 2004/0169264
Chip Structure with Bumps and Testing Pads
Patent: 7,855,461 →
Application: 12/127,794 →
Publication: US 2008/0224326
Method of Joining Chips Utilizing Copper Pillar
Patent: 8,021,921 →
Application: 12/128,644 →
Publication: US 2008/0227237
Cylindrical Bonding Structure and Method of Manufacture
Patent: 8,890,336 →
Application: 12/132,628 →
Publication: US 2008/0296761
Integrated Chip Package Structure Using Organic Substrate and Method of Manufacturing the Same
Patent: 7,898,058 →
Application: 12/172,275 →
Publication: US 2008/0265401
Chip Structure with Bumps and Testing Pads
Patent: 7,977,803 →
Application: 12/941,069 →
Publication: US 2011/0049515
Chip Structure and Process for Forming the Same
Patent: 8,546,947 →
Application: 13/191,356 →
Publication: US 2011/0278727
Chip Structure and Process for Forming the Same
Patent: 8,368,204 →
Application: 13/277,142 →
Publication: US 2012/0098128
Related Assignments (10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 9, 2013
From: KUO, NICK; CHOU, CHIU-MING; CHOU, CHIEN-KANG; LIN, CHU-FU
To: MEGIC CORPORATION
Reel/Frame 030757/0615 →
Assignment of Assignor's Interest Jul 9, 2013
From: LIN, SHIH-HSIUNG; LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 030757/0775 →
Assignment of Assignor's Interest Jul 9, 2013
From: LEE, JIN-YUAN; CHOU, CHIEN-KANG; LIN, SHIH-HSIUNG; KUO, HSI-SHAN
To: MEGIC CORPORATION
Reel/Frame 030757/0841 →
Assignment of Assignor's Interest Jul 9, 2013
From: KUO, NICK; CHOU, CHIU-MING; CHOU, CHIEN-KANG; LIN, CHU-FU
To: MEGIC CORPORATION
Reel/Frame 030758/0057 →
Assignment of Assignor's Interest Jul 9, 2013
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN; HUANG, CHING-CHENG
To: MEGIC CORPORATION
Reel/Frame 030758/0149 →
Assignment of Assignor's Interest Jul 9, 2013
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN; HUANG, CHING-CHENG
To: MEGIC CORPORATION
Reel/Frame 030758/0348 →
Assignment of Assignor's Interest Jul 9, 2013
From: LEE, JIN-YUAN; LIN, MOU-SHIUNG; HUANG, CHING-CHENG
To: MEGIC CORPORATION
Reel/Frame 030773/0172 →
Assignment of Assignor's Interest Jul 10, 2013
From: LEE, JIN-YUAN; LIN, MOU-SHIUNG; HUANG, CHING-CHENG
To: MEGIC CORPORATION
Reel/Frame 030776/0079 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →