Patent Assignment
Reel/Frame 030773/0172
Assignment of Assignor's Interest
Recorded: 2013-07-09
Pages: 3
Assignors
LEE, JIN-YUAN
Executed: 2002-01-18
LIN, MOU-SHIUNG
Executed: 2002-01-18
HUANG, CHING-CHENG
Executed: 2002-01-18
Assignee
MEGIC CORPORATION
21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Property
(1)
Integrated Chip Package Structure Using Organic Substrate and Method of Manufacturing the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 10, 2013
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030770/0132 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →