Integrated chip package structure using organic substrate and method of manufacturing the same
View Patent ↗An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.
1. A chip package comprising:
a first polymer layer;
a first die between a first portion of said first polymer layer and a second portion of said first polymer layer, wherein said first die has a top surface substantially coplanar with a top surface of said first polymer layer;
a second polymer layer on said top surface of said first die and on said top surface of said first polymer layer;
a circuit metal layer on said second polymer layer, over said top surface of said first die and over said top surface of said first polymer layer, wherein there is no metal layer between said circuit metal layer and said top surface of said first polymer layer, wherein said circuit metal layer is connected to a first metal pad of said first die through a first opening in said second polymer layer, wherein said circuit metal layer comprises a portion as a part of a capacitor; and
a third polymer layer on said circuit metal layer, on said second polymer layer, over said top surface of said first die and over said top surface of said first polymer layer.
2. The chip package of claim 1 further comprising a second die between said second portion of said first polymer layer and a third portion of said first polymer layer, wherein said second die has a top surface substantially coplanar with said top surface of said first polymer layer, wherein said circuit metal layer is connected to a second metal pad of said second die through a second opening in said second polymer layer, wherein said first metal pad is connected to said second metal pad through said circuit metal layer.
3. The chip package of claim 1 further comprising a substrate joining a bottom surface of said first die using an adhesive material.
4. The chip package of claim 1 , wherein said circuit metal layer comprises electroplated copper.
5. The chip package of claim 1 , wherein said first polymer layer comprises epoxy.
6. The chip package of claim 1 , wherein said second polymer layer comprises polyimide.
7. A chip package comprising:
a first polymer layer;
a first die between a first portion of said first polymer layer and a second portion of said first polymer layer, wherein said first die has a top surface substantially coplanar with a top surface of said first polymer layer;
a second polymer layer on said top surface of said first die and on said top surface of said first polymer layer;
a circuit metal layer on said second polymer layer, over said top surface of said first die and over said top surface of said first polymer layer, wherein there is no metal layer between said circuit metal layer and said top surface of said first polymer layer, wherein said circuit metal layer is connected to a first metal pad of said first die through a first opening in said second polymer layer, wherein said circuit metal layer comprises a portion as a part of an inductor; and
a third polymer layer on said circuit metal layer, on said second polymer layer, over said top surface of said first die and over said top surface of said first polymer layer.
8. The chip package of claim 7 further comprising a second die between said second portion of said first polymer layer and a third portion of said first polymer layer, wherein said second die has a top surface substantially coplanar with said top surface of said first polymer layer, wherein said circuit metal layer is connected to a second metal pad of said second die through a second opening in said second polymer layer, wherein said first metal pad is connected to said second metal pad through said circuit metal layer.
9. The chip package of claim 7 further comprising a substrate joining a bottom surface of said first die using an adhesive material.
10. The chip package of claim 7 , wherein said circuit metal layer comprises electroplated copper.
11. The chip package of claim 7 , wherein said first polymer layer comprises epoxy.
12. The chip package of claim 7 , wherein said second polymer layer comprises polyimide.
13. The chip package of claim 7 , wherein said third polymer layer comprises polyimide.
14. A chip package comprising:
a first polymer layer;
a first die between a first portion of said first polymer layer and a second portion of said first polymer layer, wherein said first die has a top surface substantially coplanar with a top surface of said first polymer layer;
a second polymer layer on said top surface of said first die and on said top surface of said first polymer layer;
a circuit metal layer on said second polymer layer, over said top surface of said first die and over said top surface of said first polymer layer, wherein there is no metal layer between said circuit metal layer and said top surface of said first polymer layer, wherein said circuit metal layer is connected to a first metal pad of said first die through a first opening in said second polymer layer, wherein said circuit metal layer comprises a portion as a part of a resistor; and
a third polymer layer on said circuit metal layer, on said second polymer layer, over said top surface of said first die and over said top surface of said first polymer layer.
15. The chip package of claim 14 further comprising a second die between said second portion of said first polymer layer and a third portion of said first polymer layer, wherein said second die has a top surface substantially coplanar with said top surface of said first polymer layer, wherein said circuit metal layer is connected to a second metal pad of said second die through a second opening in said second polymer layer, wherein said first metal pad is connected to said second metal pad through said circuit metal layer.
16. The chip package of claim 14 further comprising a substrate joining a bottom surface of said first die using an adhesive material.
17. The chip package of claim 14 , wherein said circuit metal layer comprises electroplated copper.
18. The chip package of claim 14 , wherein said first polymer layer comprises epoxy.
19. The chip package of claim 14 , wherein said second polymer layer comprises polyimide.
20. The chip package of claim 14 , wherein said third polymer layer comprises polyimide.