IP Library › Assignment 030757/0775
Patent Assignment
Reel/Frame 030757/0775

Assignment of Assignor's Interest

Recorded: 2013-07-09 Pages: 3
Assignors
LIN, SHIH-HSIUNG
Executed: 2003-10-20
LIN, MOU-SHIUNG
Executed: 2003-10-20
Assignee
MEGIC CORPORATION
NO. 21, R&D 1ST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Property (1)
Method of Joining Chips Utilizing Copper Pillar
Patent: 8,021,921 →
Application: 12/128,644 →
Publication: US 2008/0227237
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 10, 2013
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030770/0132 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →