Patent Assignment
Reel/Frame 030759/0766
Assignment of Assignor's Interest
Recorded: 2013-07-09
Pages: 2
Assignors
YU, TSUNG-YUAN
Executed: 2013-06-10
CHEN, HSIEN-WEI
Executed: 2013-06-10
CHEN, JIE
Executed: 2013-06-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Ball Height Control in Bonding Process