Patent Assignment
Reel/Frame 030760/0202
Assignment of Assignor's Interest
Recorded: 2013-07-09
Pages: 4
Assignors
LU, WEN-HSIUNG
Executed: 2013-06-26
KUO, HSUAN-TING
Executed: 2013-06-26
CHEN, CHENG-TING
Executed: 2013-06-26
ANG, AI-TEE
Executed: 2013-06-26
CHENG, MING-DA
Executed: 2013-06-26
LIU, CHUNG-SHI
Executed: 2013-06-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Interconnect Structure and Method of Fabricating Same