Patent Assignment
Reel/Frame 030761/0350
Assignment of Assignor's Interest
Recorded: 2013-07-09
Pages: 3
Assignor
LIN, MOU-SHIUNG
Executed: 2000-09-21
Assignee
MEGIC CORPORATION
21, R&D FIRST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Post Passivation Interconnection Schemes on Top of the Ic Chips
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 10, 2013
From: MEGICA CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030770/0876 →
Assignment of Assignor's Interest
Aug 9, 2013
From: LEE, JIN-YUAN
To: MEGIC CORP.
Reel/Frame 030981/0824 →
Corrective Assignment to Correct the Conveying Party Name Needs to Change from Megica to Megic Previously Recorded on Reel 030770 Frame 0876. Assignor(S) Hereby Confirms the Megic Corporation to Megica Corporation.
Aug 9, 2013
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030997/0336 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →
Corrective Assignment to Correct the Assignee Name Inside the Assignment Document Previously Recorded at Reel: 030761 Frame: 0350. Assignor(S) Hereby Confirms the Assignment.
Jun 26, 2017
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN
To: MEGIC CORPORATION
Reel/Frame 043006/0808 →