Patent Assignment
Reel/Frame 030770/0876
Assignment of Assignor's Interest
Recorded: 2013-07-10
Pages: 7
Assignor
MEGICA CORPORATION
Executed: 2006-04-28
Assignee
MEGICA CORPORATION
ROOM 301/302, NO 47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Properties
(35)
Structure of High Performance Combo Chip and Processing Method
Post Passivation Metal Scheme for High-Performance Integrated Circuit Devices
Patent:
43,674 →
Application:
11/518,595 →
Method of Wire Bonding Over Active Area of a Semiconductor Circuit
Application:
11/678,597 →
Publication:
US 2007/0164412
Method of Wire Bonding Over Active Area of a Semiconductor Circuit
Method of Wire Bonding Over Active Area of a Semiconductor Circuit
Method of Wire Bonding Over Active Area of a Semiconductor Circuit
Method of Wire Bonding Over Active Area of a Semiconductor Circuit
Post Passivation Interconnection Schemes on Top of the Ic Chips
Post Passivation Interconnection Schemes on Top of the Ic Chips
High Performance System-on-Chip Using Post Passivation Process
Application:
11/877,641 →
Publication:
US 2008/0042238
High Performance System-on-Chip Using Post Passivation Process
High performance system-on-chip using post passivation process
Application:
11/877,652 →
Publication:
US 2008/0044977
High Performance System-on-Chip Using Post Passivation Process
Application:
11/877,654 →
Publication:
US 2008/0042289
Top Layers of Metal for Integrated Circuits
Post Passivation Interconnection Schemes on Top of the Ic Chips
Post Passivation Interconnection Schemes on Top of the Ic Chips
Method of Wire Bonding Over Active Area of a Semiconductor Circuit
Method of Wire Bonding Over Active Area of a Semiconductor Circuit
Low Fabrication Cost, High Performance, High Reliability Chip Scale Package
Top Layers of Metal for High Performance Ic's
High Performance System-on-Chip Using Post Passivation Process
Application:
11/957,509 →
Publication:
US 2008/0111243
High performance system-on-chip using post passivation process
Application:
11/957,510 →
Publication:
US 2008/0093745
Structure and Manufacturing Method of a Chip Scale Package
A Structure and Manufacturing Method of a Chip Scale Package with Low Fabrication Cost, Fine Pitch and High Reliability Solder Bump
Top Layers of Metal for Integrated Circuits
High Performance Sub-System Design and Assembly
Post Passivation Interconnection Schemes on Top of the Ic Chips
Reliable Metal Bumps on Top of I/O Pads After Removal of Test Probe Marks
Post Passivation Interconnection Process and Structures
Chip Package
Post Passivation Interconnection Schemes on Top of the Ic Chips
Low Fabrication Cost, Fine Pitch and High Reliability Solder Bump
Circuit Component with Conductive Layer Structure
Chip Structure
High Performance Ic Chip Having Discrete Decoupling Capacitors Attached to Its Ic Surface
Application:
13/735,894 →
Publication:
US 2014/0021630
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 9, 2013
From: LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 030761/0863 →
Assignment of Assignor's Interest
Jul 9, 2013
From: LEE, JIN-YUAN; CHEN, YING-CHIH
To: MEGIC CORPORATION
Reel/Frame 030757/0737 →
Assignment of Assignor's Interest
Jul 9, 2013
From: LEE, JIN-YUAN; CHEN, YING-CHIH
To: MEGIC CORPORATION
Reel/Frame 030757/0758 →
Assignment of Assignor's Interest
Jul 9, 2013
From: LEE, JIN-YUAN; CHEN, YING-CHIH
To: MEGIC CORPORATION
Reel/Frame 030757/0850 →
Assignment of Assignor's Interest
Jul 9, 2013
From: LEE, JIN-YUAN; CHEN, YING-CHIH
To: MEGIC CORPORATION
Reel/Frame 030757/0935 →
Assignment of Assignor's Interest
Jul 9, 2013
From: LEE, JIN-YUAN; CHEN, YING-CHIH
To: MEGIC CORPORATION
Reel/Frame 030758/0040 →
Assignment of Assignor's Interest
Jul 9, 2013
From: LEE, JIN-YUAN; CHEN, YING-CHIH
To: MEGIC CORPORATION
Reel/Frame 030758/0128 →
Assignment of Assignor's Interest
Jul 9, 2013
From: LEE, JIN-YUAN; CHEN, YING-CHIH
To: MEGIC CORPORATION
Reel/Frame 030758/0192 →
Assignment of Assignor's Interest
Jul 9, 2013
From: LIN, MOU-SHIUNG; LEE, JIN-YUAN
To: MEGIC CORPORATION
Reel/Frame 030759/0423 →
Assignment of Assignor's Interest
Jul 9, 2013
From: LIN, MOU-SHIUNG; CHOU, CHIU-MING; CHOU, CHIEN-KANG
To: MEGIC CORPORATION
Reel/Frame 030760/0960 →
Assignment of Assignor's Interest
Jul 9, 2013
From: LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 030761/0270 →
Assignment of Assignor's Interest
Jul 9, 2013
From: LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 030761/0350 →
Assignment of Assignor's Interest
Jul 9, 2013
From: LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 030761/0657 →
Assignment of Assignor's Interest
Jul 9, 2013
From: LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 030761/0693 →
Assignment of Assignor's Interest
Jul 9, 2013
From: LIN, MOU-SHIUNG
To: MEGIC CORPORATION
Reel/Frame 030761/0849 →
Assignment of Assignor's Interest
Jul 10, 2013
From: LEE, JIN-YUAN
To: MEGIC CORPORATION
Reel/Frame 030765/0662 →
Assignment of Assignor's Interest
Jul 10, 2013
From: LIN, MOU-SHIUNG; CHOU, CHIU-MING; CHOU, CHIEN-KANG
To: MEGIC CORPORATION
Reel/Frame 030764/0335 →
Assignment of Assignor's Interest
Jul 10, 2013
From: LEE, JIN-YUAN; LEI, MING-TA; HUANG, CHING-CHENG; LIN, CHUEN-JYE
To: MEGIC CORPORATION
Reel/Frame 030764/0496 →
Assignment of Assignor's Interest
Jul 10, 2013
From: LIN, MOU-SHIUNG; LEI, MING-TA; LEE, JIN-YUAN; HUANG, CHING-CHENG
To: MEGIC CORPORATION
Reel/Frame 030766/0828 →
Corrective Assignment to Correct the Conveying Party Name Needs to Change from Megica to Megic Previously Recorded on Reel 030770 Frame 0876. Assignor(S) Hereby Confirms the Megic Corporation to Megica Corporation.
Aug 9, 2013
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030997/0336 →
Assignment of Assignor's Interest
Aug 9, 2013
From: LEE, JIN-YUAN
To: MEGIC CORP.
Reel/Frame 030981/0824 →
Assignment of Assignor's Interest
Aug 9, 2013
From: LIN, MOU-SHIUNG
To: MEGICA CORPORATION
Reel/Frame 030981/0842 →
Assignment of Assignor's Interest
Aug 12, 2013
From: LIN, MOU-SHIUNG
To: MEGICA CORPORATION
Reel/Frame 030986/0171 →
Assignment of Assignor's Interest
Aug 12, 2013
From: LIN, MOU-SHIUNG
To: MEGICA CORPORATION
Reel/Frame 030986/0404 →
Assignment of Assignor's Interest
Aug 12, 2013
From: LIN, MOU-SHIUNG
To: MEGICA CORPORATION
Reel/Frame 030986/0425 →