Patent Assignment
Reel/Frame 030757/0758
Assignment of Assignor's Interest
Recorded: 2013-07-09
Pages: 3
Assignee
MEGIC CORPORATION
21, R&D 1ST. RD., SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Method of Wire Bonding Over Active Area of a Semiconductor Circuit
Application:
11/678,597 →
Publication:
US 2007/0164412
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 10, 2013
From: MEGICA CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030770/0876 →
Corrective Assignment to Correct the Conveying Party Name Needs to Change from Megica to Megic Previously Recorded on Reel 030770 Frame 0876. Assignor(S) Hereby Confirms the Megic Corporation to Megica Corporation.
Aug 9, 2013
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030997/0336 →
Assignment of Assignor's Interest
Aug 12, 2013
From: LIN, MOU-SHIUNG
To: MEGICA CORPORATION
Reel/Frame 030986/0171 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →