Patent Assignment
Reel/Frame 030766/0828
Assignment of Assignor's Interest
Recorded: 2013-07-10
Pages: 4
Assignors
LIN, MOU-SHIUNG
Executed: 2001-10-22
LEI, MING-TA
Executed: 2001-10-22
LEE, JIN-YUAN
Executed: 2001-10-22
HUANG, CHING-CHENG
Executed: 2001-10-22
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, ROC, TAIWAN
Covered Property
(1)
Post Passivation Metal Scheme for High-Performance Integrated Circuit Devices
Patent:
43,674 →
Application:
11/518,595 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 10, 2013
From: MEGICA CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030770/0876 →
Corrective Assignment to Correct the Conveying Party Name Needs to Change from Megica to Megic Previously Recorded on Reel 030770 Frame 0876. Assignor(S) Hereby Confirms the Megic Corporation to Megica Corporation.
Aug 9, 2013
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 030997/0336 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →