IP Library › Assignment 030762/0113
Patent Assignment
Reel/Frame 030762/0113

Assignment of Assignor's Interest

Recorded: 2013-07-09 Pages: 3
Assignor
LEE, JIN-YUAN
Executed: 2001-08-02
Assignee
MEGIC CORPORATION
21, R&D FIRST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property (1)
Structure of High Performance Combo Chip and Processing Method
Patent: 7,517,778 →
Application: 11/901,079 →
Publication: US 2008/0009098
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 10, 2013
From: LEE, JIN-YUAN; LIN, MOU-SHIUNG
To: MEGICA CORPORATION
Reel/Frame 030765/0624 →
Assignment of Assignor's Interest Sep 4, 2013
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 031134/0848 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →