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Patent Assignment
Reel/Frame 031134/0848

Assignment of Assignor's Interest

Recorded: 2013-09-04 Pages: 6
Assignor
MEGIC CORPORATION
Executed: 2006-04-28
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Property (1)
Structure of High Performance Combo Chip and Processing Method
Patent: 7,517,778 →
Application: 11/901,079 →
Publication: US 2008/0009098
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 9, 2013
From: LEE, JIN-YUAN
To: MEGIC CORPORATION
Reel/Frame 030762/0113 →
Assignment of Assignor's Interest Jul 10, 2013
From: LEE, JIN-YUAN; LIN, MOU-SHIUNG
To: MEGICA CORPORATION
Reel/Frame 030765/0624 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →