Patent Assignment
Reel/Frame 030762/0584
Assignment of Assignor's Interest
Recorded: 2013-07-09
Pages: 8
Assignors
IIZUMI, TAKESHI
Executed: 2013-07-04
WATANABE, KATSUHIDE
Executed: 2013-07-04
KOBAYASHI, YOICHI
Executed: 2013-07-04
Assignee
EBARA CORPORATION
11-1, HANEDA ASAHI-CHO, OHTA-KU, TOKYO, 144-8510, JAPAN
Covered Property
(1)
A Method of Polishing a Substrate Having a Film on a Surface of the Substrate for Semiconductor Manufacturing