Patent Assignment
Reel/Frame 030764/0305
Assignment of Assignor's Interest
Recorded: 2013-07-10
Pages: 4
Assignors
LU, WEN-HSIUNG
Executed: 2013-04-10
KUO, HSUAN-TING
Executed: 2013-04-10
YU, TSUNG-YUAN
Executed: 2013-04-10
CHEN, HSIEN-WEI
Executed: 2013-04-10
CHENG, MING-DA
Executed: 2013-04-10
LIU, CHUNG-SHI
Executed: 2013-04-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Interconnect Structures and Methods of Forming Same